Flip Chip Technology Market worth 31.27 Billion USD by 2022
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The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The growth of flip chip technology market is mainly attributed to the increasing demand for miniaturization and high performance in electronic devices and strong penetration of the advanced packaging technology in the consumer electronics sector. There has been considerable reduction in the size of the die, with the introduction of flip chip packaging technology, thereby saving the silicon cost. Also the total package size can also be reduced using flip chip technology. The other benefits of flip chip technology include reduction in signal inductance, reduction in power inductance, and higher signal density.
The scope of this report covers the flip chip technology market by bumping process, packaging technology, packaging type, product, application, and region. The copper pillar process is expected to hold the largest market share of the global market, and it is also expected to be the fastest-growing technology to manufacture chips in various applications during the forecast period. The maximum growth of Cu pillars is driven by the need of finer pitches, higher I/O counts, lithography nodes below 28nm, emergence of 2.5D/3D packaging, and increased current density, and thermal dissipation needs.
